Dip-Spin coating is a procedure used to deposit uniform thin films to flat substrates. Usually a small amount of coating material is applied on the center of the substrate, which is either spinning at low speed or not spinning at all. The substrate is then rotated at high speed in order to spread the coating material by centrifugal force. A machine used for spin coating is called a spin coater, or simply spinner.
Spin coating is widely used in microfabrication of functional oxide layers on glass or single crystal substrates using sol-gel precursors, where it can be used to create uniform thin films with nanoscale thicknesses. It is used intensively in photolithography, to deposit layers of photoresist about 1 micrometre thick. Photoresist is typically spun at 20 to 80 revolutions per second for 30 to 60 seconds.
Dip/spin technology is compatible with all major coatings types used in fastener finishing; specifically, coatings that combine high resistance to chemical and galvanic/bi-metallic corrosion with UV stability, anti-galling properties and/or anti-vibration characteristics. Most would also be compatible with sealants, adhesives and locking patches and would be dry to the touch when cured. The specific coating types involved include fluorocarbons, zinc-rich, ceramic metallics (aluminum-based with organic or inorganic topcoats) and waterborne systems.